Question

Defects that can arise in this process include non-wet open and head-on-pillow. The 853D and 926LED-III are among the devices made by Yihua for performing this action, which is also what the American company Hakko makes tools for. A ball grid array design contains many namesake balls or bumps that this process (-5[1])is applied to. (15[1])The “dip” and “wave” types of this process involve dipping certain parts in a bath. This action can be undone with a rework gun (15[1])or a pump-like device called a namesake (*) “sucker”. “Stations” used for this action often include a wire (10[1])mesh or sponge for cleaning tips. (10[1])“Cold joints” may arise from improperly performing this action, which uses a lower temperature than the similar processes (10[1])of brazing and welding. For 10 points, a namesake iron is used for what process of melting a lead or tin alloy to join electrical components? ■END■

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