Question

Defects that can arise in this process include non-wet open and head-on-pillow. The 853D and 926LED-III are among the devices made by Yihua for performing this action, which is also what the American company Hakko makes tools for. A ball grid array design contains many namesake balls or bumps that this process is applied to. The “dip” (15[1])and “wave” types of this process (-5[1])involve (0[1])dipping certain parts in a bath. This action can be undone with a rework gun or a pump-like device called a namesake (*) “sucker”. (10[1])“Stations” (10[1])used for this action often include a wire mesh or sponge for cleaning tips. “Cold joints” may arise from improperly performing this action, which uses a lower temperature than the similar processes of brazing and welding. For 10 points, a namesake iron is used for what process of melting a lead or tin alloy to join electrical components? ■END■

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